Xradia Exhibits X-ray Vision for Semiconductor Failure Analysis at Semicon Japan

September 28, 2016

Xradia Exhibits X-ray Vision for Semiconductor Failure Analysis at Semicon Japan

Tokyo, Japan, December 1, 2010: Xradia Inc., the leading provider of high-resolution non destructive 3D X-ray imaging systems, announced today that its solutions for semiconductor failure analysis will be presented by its representative, Canon Marketing Group Japan, in CMJ’s booth 3C-701 during Semicon Japan. Representatives will discuss imaging solutions from 30 µm to 50 nm with its MicroXCT and UltraXRM computed tomography technology for a range of failure analysis issues.

“Semiconductor packaging is rapidly moving to a 3D state. It is logical that characterization and failure analysis should also be approached from a 3D perspective. Today’s packages require X-ray vision,” says Dr. Kevin Fahey, V.P. of Marketing at Xradia, Inc. “Our high resolution 3D X-ray imaging solutions make it possible to visualize buried problems without destroying the package, or inducing artifacts that have nothing to do with the actual condition of the package. By inspecting intact packages, we are able to isolate specific conditions that may be causing the failure.”

Xradia solutions enable discovery of package failures from a myriad of conditions, including at multiple interfaces in complex 3D chip packages. Defects such as (C4) bump cracking and “invisible” non-wet defects, ball grid array (BGA) solder joint cracking, wirebond shorts and opens, micro voids and cracks at the substrate to bump and bump to pillar interface, bump alignment errors, Pb-free solder defects, cracked vias, delamination of the TSV trench and voids at the bottom of the TSV, etc. are all able to be imaged and analyzed. “We like to ask our customers, ‘if you could see anything, what would you look for?’ because at these levels of resolution and with a non-destructive process, they are able to see structures they’ve never seen before,” added Fahey.

Xradia offers a multi-length scale computed tomography solution between two separate product lines for the analysis of semiconductor packages. The UltraXRM-L200 provides synchrotron-like imaging down to 50 nm resolution in a laboratory setting, the only instrument in its class. The MicroXCT product line offers a wide range of magnifications and field of view options with resolutions down to submicron length scales. MicroXCT products are available for both generic lab applications, and for environmental analysis and in situ experiments.

Xradia solutions are demonstrated to provide the highest image contrast for low to high Z materials, the highest resolution across sample sizes, and the versatility required for in situ analysis and short or long scans. The strength of the company’s technology is inherent in its proprietary X-ray optics, developed over more than a decade for the world’s most demanding customers.

Semicon Japan begins today and runs through December 3, 2010 at the Makuhari Messe International Exhibition Halls & International Conference Hall at the Nippon Convention Center near Tokyo.

Interested parties may request Xradia tech notes on X-ray vision and other topics from the company’s website at www.xradia.com.

About Xradia

Xradia designs and manufactures microscopes for industrial and research applications. Xradia’s solutions offer impressive high contrast and high resolution imaging capabilities for a large range of sample sizes and shapes. Xradia’s two product families, the UltraXRM and MicroXCT, together offer a multi-lengthscale solution delivering full volume 3D imaging with resolution down to 50 nm. Additional information can be found at www.xradia.com.

About ZEISS
The Carl Zeiss Group is an international leader in the fields of optics and optoelectronics. In fiscal year 2011/12 the company’s approximately 24,000 employees generated revenue of nearly 4.2 billion euros. In the markets for Industrial Solutions, Research Solutions, Medical Technology and Consumer Optics, ZEISS has contributed to technological progress for more than 160 years and enhances the quality of life of many people around the globe. The Carl Zeiss Group develops and produces planetariums, eyeglass lenses, camera and cine lenses and binoculars as well as solutions for biomedical research, medical technology and the semiconductor, automotive and mechanical engineering industries. ZEISS is present in over 40 countries around the globe with about 40 production facilities, over 50 sales and service locations and service locations and approximately 20 research and development sites. Carl Zeiss AG is fully owned by the Carl Zeiss Stiftung (Carl Zeiss Foundation). Founded in 1846 in Jena, the company is headquartered in Oberkochen, Germany.

About Carl Zeiss Microscopy
The Microscopy business group at ZEISS is the world’s only manufacturer of light, X-ray and electron microscopes. The company’s extensive portfolio enables research and routine applications in the life and materials sciences. The product range includes light and laser scanning microscopes, X-ray microscopes, electron and ion microscopes and spectrometer modules. Users are supported for software for system control, image capture and editing. The Microscopy business group has sales companies in 33 countries. Application and service specialists support customers around the globe in demo centers and on site. The business group is headquartered in Jena, Germany. Additional production and development sites are in Oberkochen, Göttingen and Munich, as well as in Cambridge in the UK and Peabody, MA and Pleasanton, CA in the USA. The company has around 2,800 employees and generates revenue of 650 million euros. www.zeiss.de/press

Press contacts
Dr. Jochen Tham
ZEISS, Microscopy
Phone +49 3641 64-3949
Email: jochen.tham@zeiss.com

Brenda Ropoulos
ZEISS, Carl Zeiss X-ray Microscopy
Phone +1 510 414 6772
Email: brenda.ropoulos@zeiss.com

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