Archived News – 2006

Archived News – 2006

June 28 2006 – Xradia Announces New X-ray Solutions for Advanced Semiconductor Packaging

Concord, CA – June 28 2006: Xradia, Inc., a developer and manufacturer of ultra-high-resolution X-ray imaging systems for 3D tomography and nanotechnology applications, today announced the sale of three of its MicroXCTTM 3D Transmission X-ray Microscopes, to semiconductor manufacturers for advanced packaging process development and failure analysis. Combining spatial resolution below 1.5µm and feature recognition of 500nm, with full 3D tomography capability, the MicroXCTTM is ideally suited to the engineering and failure analysis of next-generation semiconductor packages, including multi stacked die and flip-chip architectures. Two of the systems are being deployed to fabs in the US for advanced package development and the third is headed to Asia where it will be used to examine ball grid arrays.
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June 1, 2006 – Xradia Announces $2.0M Contract for Hard X-ray Nanoprobe Instrument

Concord, CA, and Argonne, IL – June 1, 2006: Xradia, Inc., a developer and manufacturer of ultra-high-resolution X-ray imaging systems for 3D tomography and nanotechnology applications, today announced the award of a $2M contract from the Argonne National Laboratory’s Center for Nanoscale Materials (CNM). The contract calls for the participation in the design and engineering of a high resolution hard X-ray nanoprobe instrument (NPI) for 30nm high-resolution elemental and structural analysis using scanning probe and full-field transmission X-ray microscopy. The NPI will be installed at the Hard X-ray Nanoprobe Beamline at Argonne’s Advanced Photon Source (APS) as part of a joint development effort between the CNM and APS.
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