Multi Length Scale

Understanding XRM Technology
Multi-length Scale
Multi-length Scale Imaging: Bridge the 3D Resolution Gap

Overview


You used to have to choose between industrial CT and electron microscopy. Between high resolution imaging of small sample sizes and destructive, low-res studies of your larger samples.

Now you can get the best of both worlds in a single 3D imaging solution. ZEISS 3D X-ray microscopes (XRM) bridge the resolution gap with non-destructive imaging of samples at multiple length scales to provide a complete solution.

Apply multi-length scale imaging to studies of natural and artificial materials and composites ranging from nanometers to millimeters:

  • Pore and crack structure in rocks used in geological studies for oil and gas recovery or CO2 sequestration
  • Microscopic features in biological tissues in large organs and subcellular organisms
  • Fractures in which the crack tip measures on the order of angstroms while the opening profile and geometry exceed the millimeter scale
  • Engineered microstructures—fibers, matrix composites, sintered materials—with complex features that must be observed at more than one length-scale.
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Architecture


Multiple Length Scales, Single Solution Suite

Use the flexible end-to-end ZEISS solution suite to observe and quantify structures at every critical length scale. Study a wide range of structures using variable magnification to observe three-dimensional features across multiple length scales:

  • Xradia Versa span sample sizes from sub-millimeter to inches with resolution down to 700 nanometers. Unique multi-objective turret microscope design enables Scout-and-Zoom—a quick survey of an entire sample at medium resolution (scout) followed by higher resolution sampling (zoom) of regions of interest
  • Xradia Ultra targets samples up to a millimeter in size with resolution down to 50 nanometers


Applications and Techniques


Perform complex investigations previously unachievable in the imaging lab:

  • Bone: Explore complex hierarchical structures from the sub-millimeter trabecular level down to the nanometer canalicular level.
  • Semiconductor failure analysis (FA): High penetrative power combines with high resolution to advance new workflows. Identify ROIs using conventional input from low-resolution failure analysis tools such as electrical TDR then use Xradia Versa to non-destructively perform virtual cross-sectioning at higher resolutions—all without de-packaging.
  • Correlative microscopy: Gain maximum insight from your samples before forwarding them on for destructive study. First, gain the 3D structural and coordinate information needed to localize and visualize defects for classification, then conduct additional testing can resolve inconsistencies, strain samples to failure, perform thermal analysis, or observe failure evolution in situ.
  • Heterogeneous rock and other geo materials: Characterize sandstone, shale, carbonate and other substances by microstructure across length scales. ZEISS XRM solutions deliver multi-length scale analysis of porosity needed for virtual flow models that enhance special core analysis for oil drilling exploration and well feasibility studies.


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